| Specifications |
PDF
12" x 24"
|
PDF
4" x 6" |
| Temperature Rating |
Ambient to +300°F/150°C |
| Current Requirements |
7.5 Amps (Typical), 10 Amps (Maximum) |
| Voltage Requirements |
115 VAC |
| Temperature Control |
Internal Athena Series 86 Controller |
| Temperature Uniformity* |
Ambient to +249°F = -10°F |
| +250°F to 300°F = -13°F |
| Total Size |
18" x 15.75" x 3.25"(H) |
| Thermocouple Outputs |
Type J (Standard) K, T, E-Available |
| *Temperature uniformity is the surface
temperature variance from the center of the hot plate to the outer edges
and corners. |
|
IMPORTANCE NOTICE: The 1/8" silicone sponger rubber padding put on top of
the HPS framework to improve operator comfort and reduce the framework surface temperature may be harmful
to some SMD applications. Concerns regarding the possible contamination of SMD devices from
contact with the silicone padding has made
it necessary to offer the HPS without silicone padding for
sensitive applications. The HPS may be used without any padding at all (the framework has a painted
surface) or the user can apply their own recommended padding. Please refer to ordering code
for additional information. |
HPS Hot Plate Assembly Station for SMD